Fibocom FG170-NA is a 5G module designed specifically for the North American market, compliant with the 3GPP Release 16 standard. Powered by the Qualcomm Snapdragon SDX65 chipset, it delivers a superior 5G experience and unlocking greater potential for connected devices.
The module features a LGA packaging design with dimensions of 41x44x2.75mm, ensuring full compatibility with the 5G module FG160. In the 5G NR Sub-6GHz, it offers up to 300MHz bandwidth and supports downlink NR 4CA and 4x4 MIMO in the low-frequency band. Also, it delivers impressive maximum downlink rates of 4.2Gbps and uplink rates of 900Mbps within a 5G network.
The FG170-NA module supports a variety of network protocols and integrates multiple interfaces, including USB 3.1/3.0/2.0, PCIe 4.0/3.0, I2S, and more. It can be applied in a wide range of IoT applications such as Customer Premises Equipment (CPE), HD live streaming, Industrial gateways, video surveillance, drones, VR/AR, and more.
